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September 2024

Canon Releases FPA-3030i6 Semiconductor Lithography System for Small Wafers
Canon Releases FPA-3030i6 Semiconductor Lithography System for Small Wafers

26 Sep 2024 — Canon Inc. announced on 24 September the release of the FPA-3030i6 i-line1 stepper, a new semiconductor lithography system for processing wafers with ...

Industrial Equipment

May 2024

Canon_Releases_FPD_Lithography_Equipment_for_Dashboard_Displays_and_Smartphones
Canon Releases FPD Lithography Equipment for Dashboard Displays and Smartphones

28 May 2024 — Canon Inc. announced on 27 May 2024 that the company will release “MPAsp-E1003H,” a new FPD (Flat Panel Display) lithography system compatible with 6th ...

Industrial Equipment

October 2023

Card - Nanoimprint lithography system
Nanoimprint Lithography Semiconductor Manufacturing System that Covers Diverse Applications with Simple Patterning Mechanism

31 Oct 2023 — Canon announced today the launch of the FPA-1200NZ2C nanoimprint semiconductor manufacturing equipment, which executes circuit pattern transfer, the most important ...

Industrial Equipment

March 2023

Canon Introduces a New Lithography System with Large Exposure Field at a High Resolution for Producing Full-frame CMOS Sensors, XR devices and Others_570x400
Canon Introduces a New Lithography System with Large Exposure Field at a High Resolution for Producing Full-frame CMOS Sensors, XR devices and Others

13 Mar 2023 — Canon announced today that the company will release the FPA-5550iX i-line stepper semiconductor lithography system for front-end processes that realizes a large ...

Industrial Equipment

December 2022

Canon Announces the PD-710 Device that Realizes High-precision Non-contact Measurement of Target Object Displacement and Speed on Manufacturing Lines and Featuring New Optical System that Greatly Increases Measurement Range
Canon Announces the PD-710 Device that Realizes High-precision Non-contact Measurement of Target Object Displacement and Speed on Manufacturing Lines and Featuring New Optical System that Greatly Increases Measurement Range

20 Dec 2022 — Canon announced today the launch in Japan of a new measurement device for making high-precision measurements of components, parts and other objects on manufacturing ...

Industrial Equipment
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New Canon Option for Semiconductor Lithography System Back-end Process Contributes to 3D Advanced Packaging Technologies, Enables Mass Production of Dense Circuitry with Exposure Fields of Up to 100 mm x 100 mm

06 Dec 2022 — Canon Inc. announced today the launch in Japan of the FPA-5520iV LF2 Option for back-end process semiconductor lithography i-line stepper systems that contributes ...

Industrial Equipment
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