Atomic Diffusion Bonding Equipment
Atomic Diffusion Bonding Equipment
Atomic Diffusion Bonding Equipment
Wafer Bonding Equipment
Ultra-high vacuum in-situ processes of wafer transfer, film deposition, bonding and bonded wafer collection with automatic operation.
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Key Features
Application
- RF Filter
- Power Devices
- LED
- MEMS
Features
- Robust bonding at room temperature and without load force
- Compatible with various substrate materials
- Clean bonding interface through in-situ processing from bonding film deposition to wafer bonding
- Adjustable bonding interface resistance
Leading the Future with Technology
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- 01. Prices, specifications, availability and terms of offers may change without notice.
- 02. Products / Services may be manufactured by and/or supplied to us by third party manufacturers / suppliers for distribution / resale (non-Canon brand products).
- 03. Prices above are recommended retail price in SGD and may change without prior notice.